Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10995487
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Filing Dt:
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11/24/2004
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Publication #:
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Pub Dt:
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03/16/2006
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Inventor:
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Kuo-Tung Tiao
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Title:
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Chip package assembly produced thereby
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 19, INDUSTRY E. RD., IV |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE |
| SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041-3401 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F., NO. 15, INDUSTRY E. ROAD IV |
| HSINCHU SCIENCE PARK |
| HSIN-CHU 300, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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