Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11208385
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Filing Dt:
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08/19/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Inventors:
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Joosang Lee, Oseob Jeon, KeunHyuk Lee, Seungwon Lim
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Title:
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Power module package having excellent heat sink emission capability and method for manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WONMI-DISTRICT |
| (420-711) 82-3 TODANG-DONG |
| BUCHEON CITY, KYONGI PROVINCE, KOREA, REPUBLIC OF |
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| THOMAS R. FITZGERALD, ESQ. |
| 16 E. MAIN STREET, SUITE 210 |
| ROCHESTER, NY 14614-1808 |
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