Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11162789
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Filing Dt:
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09/22/2005
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Publication #:
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Pub Dt:
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03/23/2006
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Inventors:
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Tzu-Chung Wei, Jau-Shoung Chen
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Title:
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PROCESS OF FABRICATING FLIP-CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN 811 |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7 FLOOR-1, NO. 100 |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI, TAIWAN 100 |
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