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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/18/2006
Application #:
10946149
Filing Dt:
09/20/2004
Publication #:
Pub Dt:
03/23/2006
Inventors:
Chi-Shen Ho, Chang-Ming Lin
Title:
WAFER SCALE INTEGRATION PACKAGING AND METHOD OF MAKING AND USING THE SAME
Assignment: 1
Reel/Frame:
015821/0595Recorded: 09/20/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/16/2004
Exec Dt:
09/16/2004
Assignee:
1557 CENTRE POINTE DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MI 48302
Assignment: 2
Reel/Frame:
022354/0080Recorded: 03/03/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/15/2009
Assignee:
66 CHUNG SHAN ROAD
TU-CHENG, TAIPEI HSIEN, TAIWAN
Correspondent:
CLIFFORD O. CHI
PCE INDUSTRY, INC.
458 E. LAMBERT RD.
FULLERTON, CA 92835

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