Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11183893
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Filing Dt:
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07/19/2005
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Publication #:
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Pub Dt:
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04/13/2006
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Inventors:
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Kazuo Kudoh, Minoru Hirasawa, Yoshihiro Suzuki, Tomohiko Kaneyuki, Takeshi Endo
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Title:
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Multi-layer electronic component aggregate board and multi-layer electronic component fabricating method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-13-1, NIHONBASHI, CHUO-KU |
TOKYO, JAPAN 103-8272 |
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KEVIN ALAN WOLFF |
WOLFF LAW OFFICES, PLLC |
209 PROVIDENCE RD. |
CHAPEL HILL, NC 27514 |
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