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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/08/2009
Application #:
10966987
Filing Dt:
10/15/2004
Publication #:
Pub Dt:
04/20/2006
Inventors:
Kabseog Kim, Jeong-Bong Lee
Title:
TAPERED HOLLOW METALLIC MICRONEEDLE ARRAY ASSEMBLY AND METHOD OF MAKING AND USING THE SAME
Assignment: 1
Reel/Frame:
015686/0022Recorded: 02/15/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/11/2005
Exec Dt:
02/11/2005
Assignee:
201 WEST 7TH STREET
AUSTIN, TEXAS 78701
Correspondent:
EDWIN S. FLORES
CHALKER FLORES, LLP
12700 PARK CENTRAL, SUITE 455
DALLAS, TX 75251
Assignment: 2
Reel/Frame:
016015/0870Recorded: 04/06/2005Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/12/2005
Assignee:
26 ELECTRONIC PARKWAY
ROME, NEW YORK 13441-4514
Correspondent:
AIR FORCE RESEARCH LABORATORY/IFOJ
ATTN: JUDITH M. DECKER
26 ELECTRONIC PARKWAY
ROME, NY 13441-4514

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