Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10973601
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Filing Dt:
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10/26/2004
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Publication #:
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Pub Dt:
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04/27/2006
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Inventors:
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Shu Lin Ho, Shih Chieh Wang
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Title:
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PCB CAPABLE OF RELEASING THERMAL STRESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5TH FL., NO. 115, SEC. 3 MINSHENG E. RD. |
| SUNGSHAN CHIU, TAIPEI, TAIWAN 105, R.O.C. |
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| HOFFMANN & BARON, LLP |
| CHARLES R. HOFFMANN, ESQ. |
| 6900 JERICHO TURNPIKE |
| SYOSSET, NY 11791 |
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