Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11236196
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Filing Dt:
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09/27/2005
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Publication #:
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Pub Dt:
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04/27/2006
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Inventors:
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Min-Lung Huang, Yi-Hsin Chen, Jia-Bin Chen
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Title:
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Bumping process and structure thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, JINGSAN RD., NANTZ CHIU |
KAOHSIUNG, TAIWAN 811, R.O.C. |
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DANIEL R. MCCLURE |
THOMAS KAYDEN HORSTEMEYER, ET AL. |
100 GALLERIA PARKWAY |
SUITE 1750 |
ATLANTA, GA 30339 |
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