Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
03/06/2007
|
Application #:
|
11163869
|
Filing Dt:
|
11/02/2005
|
Publication #:
|
|
Pub Dt:
|
05/04/2006
| | | | |
Inventors:
|
Gwo-Liang Weng, Yung-Li Lu, Ying-Tsai Yeh
|
Title:
|
SENSOR CHIP PACKAGING STRUCTURE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
KAO-HSIUNG CITY, TAIWAN |
|
|
|
NORTH AMERICA INTELLECTUAL PROPERTY CORP |
P.O. BOX 506 |
MERRIFIELD, VA 22116 |
|
|
Search Results as of:
09/23/2024 03:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|