Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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11026880
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Filing Dt:
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12/29/2004
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Publication #:
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Pub Dt:
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05/04/2006
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Inventors:
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Ho-Yi Tsai, Chien-Ping Huang
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Title:
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SEMICONDUCTOR PACKAGE WITH HEAT SINK AND METHOD FOR FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3 |
| DA FONG ROAD, TANTZU |
| TAICHUNG HSIEN, TAIWAN R.O.C. |
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| PETER F. CORLESS |
| EDWARDS & ANGELL, LLP |
| P.O. BOX 55784 |
| BOSTON, MA 02205 |
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