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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11246248
Filing Dt:
10/11/2005
Publication #:
Pub Dt:
05/04/2006
Inventors:
Jing-Lin Zhang, Kuo-Wen Chen
Title:
Back cover assembly structure for electronic apparatus
Assignment: 1
Reel/Frame:
017086/0919Recorded: 10/11/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2005
Exec Dt:
09/09/2005
Assignee:
NO. 2, KE BEI ROAD 5TH, SCIENCE PARK
CHU-NAN 350, MIAO-LI COUNTY, TAIWAN R.O.C.
Correspondent:
MIN, HSIEH & HACK, LLP
TIMOTHY M. HSIEH
P.O. BOX 52050
MINNEAPOLIS, MN 55402

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