Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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10520141
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Inventors:
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Shigehiro Nishino, Kazutoshi Murata
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Title:
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LARGE-DIAMETER SIC WAFER AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-4, TSUKIJI 5-CHOME, CHUO-KU |
| TOKYO 104-8439, JAPAN |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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Assignment:
2
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CHANGE OF NAME AND COMPANY SPLIT
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| 6-4, TSUKIJI 5-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3-4 NIHONBASHI, CHUO0KU |
| TOKYO, JAPAN 103-0027 |
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| DAVID D. BRUSH |
| 900 SECOND AVENUE SOUTH |
| SUITE 1400 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 050370 FRAME: 0773. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2-3-4 NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| DAVID BRUSH |
| 900 SECOND AVENUE SOUTH |
| SUITE 1400 |
| MINNEAPOLIS, MN 55402 |
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