Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11270431
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Filing Dt:
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11/08/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Inventor:
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Han-Shin Youn
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Title:
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Flip chip bonding structure using non-conductive adhesive and related fabrication method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG YEONTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HOSOON LEE |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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