Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10972459
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Filing Dt:
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10/26/2004
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Publication #:
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Pub Dt:
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05/11/2006
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Inventors:
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Cheng-Yuan Lin, Te-Chang Huang
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Title:
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Method of implanting at least one solder bump on a printed circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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91, LANE 814, TA-HSIN RD. |
SHIN CHUANG VILLAGE, LU CHU HSIANG |
TAOYUAN HSIEN, TAIWAN R.O.C. |
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ROSENBERG, KLEIN & LEE |
MORTON J. ROSENBERG, ESQ. |
3458 ELLICOTT CENTER DRIVE |
SUITE 10 |
ELLICOTT CITY, MD 21043 |
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