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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11272740
Filing Dt:
11/15/2005
Publication #:
Pub Dt:
05/18/2006
Inventors:
Cheng-Cheng Liu, Yu-Lung Wen, Shi-Yuan Fu
Title:
BGA package having substrate with exhaust hole
Assignment: 1
Reel/Frame:
017244/0553Recorded: 11/15/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2005
Exec Dt:
08/30/2005
Exec Dt:
08/31/2005
Assignee:
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOSHIUNG, TAIWAN
Correspondent:
ANDREW J. TELESZ, JR.
VOLENTINE FRANCOS & WHITT, P.L.L.C.
11951 FREEDOM DRIVE, SUITE 1260
RESTON, VA 20190

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