Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11272740
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Filing Dt:
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11/15/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Inventors:
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Cheng-Cheng Liu, Yu-Lung Wen, Shi-Yuan Fu
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Title:
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BGA package having substrate with exhaust hole
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOSHIUNG, TAIWAN |
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| ANDREW J. TELESZ, JR. |
| VOLENTINE FRANCOS & WHITT, P.L.L.C. |
| 11951 FREEDOM DRIVE, SUITE 1260 |
| RESTON, VA 20190 |
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