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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11329991
Filing Dt:
01/10/2006
Publication #:
Pub Dt:
05/25/2006
Inventors:
Wai-kin Li, Rajeev Malik, Joseph J. Mezzapelle
Title:
Apparatus and method to improve resist line roughness in semiconductor wafer processing
Assignment: 1
Reel/Frame:
017467/0157Recorded: 01/10/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/13/2002
Exec Dt:
12/18/2002
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
DELIO & PETERSON, LLC
121 WHITNEY AVENUE
NEW HAVEN, CONNECTICUT 06510
Assignment: 2
Reel/Frame:
017469/0371Recorded: 01/10/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/13/2002
Assignee:
1730 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95112
Correspondent:
DELIO & PETERSON, LLC
121 WHITNEY AVENUE
NEW HAVEN, CONNECTICUT 06510

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