Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11210700
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Filing Dt:
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08/25/2005
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Publication #:
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Pub Dt:
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05/25/2006
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Inventors:
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Cheng-Yin Lee, Wei-Chang Tai
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Title:
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METHOD FOR STACKING BGA PACKAGES WITHOUT INTERMEDIATE CIRCUIT BOARD USING REFLOWED SPACER BALLS BETWEEN CORRESPONDING CONNECTING PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOSHIUNG, TAIWAN R.O.C. |
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ANDREW J. TELESZ, JR. |
VOLENTINE FRANCOS & WHITT, P.L.L.C. |
11951 FREEDOM DRIVE, SUITE 1260 |
RESTON, VA 20190 |
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