Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11000793
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Filing Dt:
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12/01/2004
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Publication #:
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Pub Dt:
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06/01/2006
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Inventors:
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Jyu-Horng Shieh, Yi-Nien Su
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Title:
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Forming a dual damascene structure without ashing-damaged ultra-low-k intermetal dielectric
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 R.O.C. |
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WILLIAM H. MURRAY, ESQUIRE |
DUANE MORRIS LLP |
ONE LIBERTY PLACE |
PHILADELPHIA, PA 19103 |
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