Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/26/2007
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Application #:
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11008798
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Filing Dt:
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12/09/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Roger Allen Booth JR., Matthew Stephen Doyle, Don Alan Gilliland, Brian Edward Gregg et al
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Title:
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MODULAR HEAT SINK DECOUPLING CAPACITOR ARRAY FORMING HEAT SINK FINS AND POWER DISTRIBUTION INTERPOSER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION - DEPT. 917 |
| ROBERT R. WILLIAMS |
| 3605 HIGHWAY 52 NORTH |
| ROCHESTER, MN 55901-7829 |
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