Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2009
|
Application #:
|
11267632
|
Filing Dt:
|
11/03/2005
|
|
Publication #:
|
|
Pub Dt:
|
06/15/2006
| | | | |
|
Inventors:
|
Chien-Ping Huang, Chih-Ming Huang
|
|
Title:
|
HEAT DISSIPATING SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU |
| TAICHUNG, TAIWAN ROC |
|
|
|
|
| PETER F. CORLESS |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
| 64434(71987) |
|
|
Search Results as of:
06/20/2024 11:45 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
