Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11011132
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Sheng-Yuan Tsai, Chi-Wei Yang
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Title:
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Multi-socket circuit board chip bridging device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INVENTEC BUILDING |
| 66 HOU-KANG ST., SHIH-LIN DISTRICT |
| TAIPEI, TAIWAN R.O.C. |
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| EITAN, PEARL, LATZER & COHEN ZEDEK, LLP. |
| 10 ROCKEFELLER PLAZA |
| SUITE 1001 |
| NEW YORK, NY 10020 |
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