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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/19/2008
Application #:
11313698
Filing Dt:
12/22/2005
Publication #:
Pub Dt:
06/22/2006
Inventor:
Hee-Dae Kim
Title:
METHOD OF FORMING A METAL INTERCONNECTION LINE IN A SEMICONDUCTOR DEVICE USING AN FSG LAYER
Assignment: 1
Reel/Frame:
017404/0100Recorded: 12/22/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/21/2005
Assignee:
891-10, DAECHI-DONG, KANGNAM-KU
SEOUL, KOREA, REPUBLIC OF 135-523
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
017663/0468Recorded: 05/23/2006Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/24/2006
Assignee:
891-10, DAECHI-DONG, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL
1940 DUKE STREET
ALEXANDRIA, VIRGINIA 22314

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