Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2008
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Application #:
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11313721
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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07/06/2006
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Inventors:
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Sang-uk Kim, Yun-hyeok Im
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Title:
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SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| STEPHEN R. WHITT |
| VOLENTINE FRANCOS & WHITT, P.L.L.C. |
| ONE FREEDOM SQUARE |
| 11951 FREEDOM DRIVE, SUITE 1260 |
| RESTON, VA 20190 |
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