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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11314584
Filing Dt:
12/21/2005
Publication #:
Pub Dt:
07/06/2006
Inventors:
Min Keun Seo, Woon Soo Kim, Jae Hee Kim
Title:
Conductive metal plated polyimide substrate and process for manufacturing the same
Assignment: 1
Reel/Frame:
017407/0519Recorded: 12/21/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/09/2005
Exec Dt:
12/09/2005
Exec Dt:
12/09/2005
Assignee:
413-5 MAETAN 3-DONG YEONGTONG-GU
SUWON CITY, KYUNGGI-DO, KOREA, REPUBLIC OF 442-373
Correspondent:
IRVING M. WEINER, WEINER & BURT, P.C.
635 N. US-23, P.O. BOX 186
HARRISVILLE, MI 48740
Assignment: 2
Reel/Frame:
020093/0904Recorded: 11/09/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/09/2007
Assignee:
20, YOIDO-DONG, YOUNGDUNGPO-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
BIRCH STEWART KOLASCH AND BIRCH
8110 GATEHOUSE ROAD, SUITE 100 EAST
FALLS CHURCH, VA 22040

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