Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11071389
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Filing Dt:
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03/02/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Inventors:
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Yu-Wei Lin, Fu-Di Tang, Chun-Yuan Li, Terry Tsai, Yu-Ting Ho
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Title:
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Lead-frame-based semiconductor package and lead frame thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG, TAIWAN |
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| MIKIO ISHIMARU |
| THE LAW OFFICES OF MIKIO ISHIMARU |
| 1110 SUNNYVALE-SARATOGA RD., STE. A1 |
| SUNNYVALE, CA 94087 |
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