Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11326192
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Filing Dt:
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01/06/2006
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Publication #:
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Pub Dt:
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07/13/2006
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Inventors:
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Se-Young Jeong, Nam-Seog Kim, Sung-Ki Lee, Ki-Kwon Jeong, Tae-Sung Park et al
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Title:
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Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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