Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11140745
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Filing Dt:
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06/01/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Inventors:
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Yeong-Jar Chang, Wen-Ching Wu, Kun-Lun Luo, Chia-Jen Lee
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Title:
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Wrapper testing circuits and method thereof for system-on-a-chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN ROC |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE RD., SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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