Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/03/2009
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Application #:
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11330773
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Filing Dt:
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01/11/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Inventors:
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Cheol-Joon Yoo, Jin-Ho Kim, Hee-Jin Park, Tae-Sung Yoon, Chan-Suk Lee
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Title:
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STRUCTURE FOR JOINING A SEMICONDUCTOR PACKAGE TO A SUBSTRATE USING A SOLDER COLUMN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM |
| 210 SW MORRISON STREET, SUITE 400 |
| HOSOON LEE |
| PORTLAND, OR 97204 |
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