Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11347942
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Filing Dt:
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02/06/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Inventors:
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Yuan-Chang Huang, Yao-Sheng Lin
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Title:
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Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU, TAIWAN 310 |
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| CLARK A. JABLON [681954-65U1] |
| AKIN GUMP STRAUSS HAUER & FELD |
| 2005 MARKET STREET, SUITE 2200 |
| PHILADELPHIA, PA 19103-7013 |
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