Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10906269
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Filing Dt:
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02/11/2005
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Publication #:
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Pub Dt:
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08/17/2006
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Inventors:
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Sheng Liu, Bin Chen, Junjie Chen, Jun Wei, Xiaojun Wang
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Title:
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Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level Packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHENG LIU, JUNJIA CHEN, BIN CHAN |
| FINEMEMS INC. |
| RM 309, NO. 518 B, BIBO RD. |
| ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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