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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/16/2007
Application #:
11388316
Filing Dt:
03/24/2006
Publication #:
Pub Dt:
08/17/2006
Inventors:
Thomas C. Bristow, Shu W. Wang, John E. Stephan
Title:
METHOD AND APPARATUS FOR MEASURING WAFER THICKNESS
Assignment: 1
Reel/Frame:
017824/0036Recorded: 04/25/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Assignee:
3 TOWNLINE CIRCLE
ROCHESTER, NEW YORK 14623
Correspondent:
NEAL L. SLIFKIN
HARRIS BEACH PLLC
99 GARNSEY ROAD
PITTSFORD, NY 14534

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