Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11352238
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Filing Dt:
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02/13/2006
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Publication #:
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Pub Dt:
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08/17/2006
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Inventors:
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Seung Eun Lee, Yul Kyo Chung, Hyo Soon Shin, Seung Hyun Sohn
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Title:
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Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 60 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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