Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11408521
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Filing Dt:
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04/21/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Inventor:
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Sung Sik Jang
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Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
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Assignment:
1
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PATENT SECURITY AGREEMENT
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901 MAIN STREET |
22ND FLOOR |
DALLAS, TEXAS 75202 |
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EDWARD T. WHITE - HUNTON & WILLIAMS LLP |
951 EAST BYRD STREET |
RIVERFRONT PLAZA, EAST TOWER |
RICHMOND, VA 23219-4074 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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901 MAIN STREET |
22ND FLOOR |
DALLAS, TEXAS 75202 |
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STEPHEN P. DEMM |
951 EAST BYRD STREET |
RIVERFRONT PLAZA - EAST TOWER |
RICHMOND, VA 23219-4074 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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333 SOUTH HOPE STREET |
19TH FLOOR |
LOS ANGELES, CALIFORNIA 90071 |
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MCGUIREWOODS LLP |
1750 TYSONS BOULEVARD |
SUITE 1800 |
TYSONS, VA 22102 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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