Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11345667
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Filing Dt:
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02/02/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Inventors:
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Horst Theuss, Michael Weber
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Title:
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Electronic component with stacked semiconductor chips and method for producing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| MUNICH, GERMANY 81669 |
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| PJF (EDELL, SHAPIRO & FINNAN) |
| 1901 RESEARCH BLVD. |
| SUITE 400 |
| ROCKVILLE, MD 20850 |
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