Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11138819
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Filing Dt:
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05/27/2005
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Publication #:
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Pub Dt:
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08/24/2006
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Inventors:
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Koji Nozaki, Takahisa Namiki, Miwa Kozawa
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Title:
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Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-8588 |
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| WESTERMAN, HATTORI, DANIELS, ET AL. |
| 1250 CONNECTICUT AVENUE, N.W., SUITE 700 |
| WASHINGTON, D.C. 20036 |
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