Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11069800
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Filing Dt:
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02/28/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Inventors:
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Robert William Hitzfeld, Jennifer Ai-Ming Loo, Murali Ramasubramanian
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Title:
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Methods and systems for electroplating wafers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LOCATELLIKADE 1 |
| PARNASSUSTOREN |
| 1076 AZ AMSTERDAM, NETHERLANDS |
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| HITACHI GLOBAL STORAGE TECHNOLOGIES |
| INTELLECTUAL PROPERTY LAW |
| 5600 COTTLE ROAD |
| DEPT. NHGB/014-2 |
| SAN JOSE, CALIFORNIA 95193 |
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