Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11306629
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Filing Dt:
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01/04/2006
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Publication #:
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Pub Dt:
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09/07/2006
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Inventors:
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Chang-Chi Lee, Tong-Hong Wang
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Title:
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PACKAGE STRUCTURE WITH HEAT SINK COMPRISING POROUS MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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