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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11356273
Filing Dt:
02/15/2006
Publication #:
Pub Dt:
09/14/2006
Inventors:
Slobodan Petrovic, Brett Vinsant
Title:
Method and apparatus for dielectric bonding of silicon wafer flow fields
Assignment: 1
Reel/Frame:
017923/0855Recorded: 05/25/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/29/2006
Exec Dt:
04/29/2006
Assignee:
7205 NW EVERGREEN PARKWAY
SUITE 100
HILLSBORO, OREGON 97124
Correspondent:
WILLIAM F. VOBACH
TOWNSEND AND TOWNSEDN AND CREW LLP
TWO EMBARCADERO CENTER
EIGHTH FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834

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