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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11354376
Filing Dt:
02/15/2006
Publication #:
Pub Dt:
09/21/2006
Inventors:
E. Jennings Taylor, Jenny J. Sun, Heather McCrabb
Title:
Electrochemical etching of circuitry for high density interconnect electronic modules
Assignment: 1
Reel/Frame:
017691/0327Recorded: 05/30/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/22/2006
Exec Dt:
03/17/2006
Exec Dt:
03/22/2006
Assignee:
315 HULS DRIVE
CLAYTON, OHIO 45315
Correspondent:
MARK P. LEVY
10 WEST SECOND STREET
2000 COURTHOUSE PLAZA, N.E.
DAYTON, OH 45402
Assignment: 2
Reel/Frame:
021021/0177Recorded: 05/30/2008Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/29/2008
Assignee:
315 HULS DRIVE
CLAYTON, OHIO 45315
Correspondent:
MARK P. LEVY
P.O. BOX 8801
2000 COURTHOUSE PLAZA, N.E.
DAYTON, OH 45402

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