Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/22/2008
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Application #:
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11080293
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Filing Dt:
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03/15/2005
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Publication #:
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Pub Dt:
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09/21/2006
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Inventors:
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Kevin L. Robinson, Larry Witkowski, Ming-Yih Kao
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Title:
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MULTI-LAYER STRUCTURE FOR USE IN THE FABRICATION OF INTEGRATED CIRCUIT DEVICES AND METHODS FOR FABRICATION OF SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| 2300 NORTHEAST BROOKWOOD PARKWAY |
| HILLSBORO, OREGON 97124 |
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| PLEVY, HOWARD & DARCY, PC |
| P.O. BOX 226 |
| FORT WASHINGTON, PA 19034 |
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