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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/17/2009
Application #:
11080195
Filing Dt:
03/15/2005
Publication #:
Pub Dt:
09/21/2006
Inventors:
Michael G. Lee, Kishio Yokouchi
Title:
HIGH DENSITY INTERCONNECTIONS WITH NANOWIRING
Assignment: 1
Reel/Frame:
016511/0025Recorded: 05/02/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/14/2005
Exec Dt:
03/14/2005
Assignee:
1-1, KAMIKODANAKA 4-CHOME
NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA, 211-8588, JAPAN
Correspondent:
SHEPPARD MULLIN RICHTER, ET AL.
ATTN: MIKE ENCINAS
333 S. HOPE STREET
48TH FLOOR
LOS ANGELES, CA 90071-1406

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