Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11338146
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Filing Dt:
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01/23/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Inventors:
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Shi-Ping Wang, Martin S. Wohlert, Alain Duboust, Renhe Jia, Feng Q. Liu, Wei-Yung Hsu et al
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Title:
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Metal CMP process on one or more polishing stations using slurries with oxidizers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 450-A |
| PATENT COUNSEL |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS INC |
| PATENT COUNSEL |
| P.O. BOX 450-A |
| SANTA CLARA, CA 95052 |
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