Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11243653
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Filing Dt:
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10/05/2005
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Publication #:
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Pub Dt:
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10/05/2006
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Inventor:
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Len Marro
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Title:
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High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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105 WILBUR PLACE |
BOHEMIA, NEW YORK 11716 |
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LOUIS WEINSTEIN |
VOLPE AND KOENIG, P.C. |
UNITED PLAZA, SUITE 1600 |
30 SOUTH 17TH STREET |
PHILADEPHIA, PENNSYLVANIA 19103 |
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