Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11327111
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Filing Dt:
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01/06/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Inventors:
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Il Sang Maeng, Myeong Ho Hong, Choon Keun Lee, Jeong Bok Kwak, Jae Choon Cho et al
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Title:
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Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN 3-DONG |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| JOSEPH R. ROBINSON |
| DARBY & DARBY P.C. |
| P.O. BOX 5257 |
| NEW YORK, NY 10150-5257 |
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