Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11367708
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Filing Dt:
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03/06/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Inventors:
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Edward G. Combs, Robert P. Sheppard, Tai Wai Pun, Neil Robert McLellan, Hau Wau Ng et al
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Title:
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Method of manufacturing enhanced thermal dissipation integrated circuit package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD |
TSUEN WAN, NEW TERRITORIES, HONG KONG |
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MAYER, BROWN, ROWE & MAW LLP |
1909 K STREET, N.W. |
WASHINGTON, DC 20006 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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28 FUI YIU KOK STREET |
UNIT E, 9/F METEX HOUSE |
TSUEN WAN, N.T., HONG KONG |
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MITCHELL M. WONG |
40 WALL STREET, FLOOR 28 |
THE EXETER LAW GROUP LLP |
NEW YORK, NY 10005 |
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06/21/2024 08:47 PM
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