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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11361619
Filing Dt:
02/24/2006
Publication #:
Pub Dt:
10/19/2006
Inventor:
Shih-Chieh Yen
Title:
Method and apparatus for bonding workpieces
Assignment: 1
Reel/Frame:
017625/0321Recorded: 02/24/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/11/2006
Assignee:
66 CHUNG SHAN ROAD
TU-CHENG TAIPEI HSIEN, TAIWAN
Correspondent:
JEFFREY T. KNAPP (PCE INDUSTRY, INC.)
458 E. LAMBERT ROAD
FULLERTON, CA 92835
Domestic rep:

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