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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
11387019
Filing Dt:
03/21/2006
Publication #:
Pub Dt:
10/19/2006
Inventor:
Carlos Dangelo
Title:
Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks
Assignment: 1
Reel/Frame:
017789/0239Recorded: 06/15/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/20/2006
Assignee:
1275 REAMWOOD AVE.
SUNNYVALE, CALIFORNIA 94089
Correspondent:
GLENN PATENT GROUP
3475 EDISON WAY, SUITE L
MENLO PARK, CA 94025
Assignment: 2
Reel/Frame:
021545/0780Recorded: 09/17/2008Pages: 3
Conveyance:
LIEN (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/17/2008
Assignee:
3475 EDISON WAY, SUITE L
MENLO PARK, CALIFORNIA 94025
Correspondent:
GLENN PATENT GROUP
3475 EDISON WAY, SUITE L
MENLO PARK, CA 94025
Assignment: 3
Reel/Frame:
025434/0839Recorded: 12/01/2010Pages: 3
Conveyance:
LIEN RELEASE
Assignor:
Exec Dt:
12/01/2010
Assignee:
1244 REAMWOOD AVE
SUNNYVALE, CALIFORNIA 94089
Correspondent:
GLENN PATENT GROUP
3475 EDISON WAY, SUITE L
MENLO PARK, CA 94025

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