Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11377996
|
Filing Dt:
|
03/17/2006
|
Publication #:
|
|
Pub Dt:
|
10/19/2006
| | | | |
Inventors:
|
Fuaida Harun, Liang Jen Koh, Lan Chu Tan
|
Title:
|
Bonding pad for a packaged integrated circuit
|
|
Assignment:
1
|
|
|
|
|
|
|
|
|
390 GREENWICH STREET |
NEW YORK, NEW YORK 10013 |
|
|
|
CBCINNOVIS DBA FEDERAL RESEARCH |
1023 FIFTEENTH STREET, NW, STE 401 |
ATTN: OLEH HERELIUK |
WASHINGTON, DC 20005 |
|
|
Assignment:
2
|
|
|
|
|
|
|
|
|
6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
|
|
|
IP RESEARCH PLUS, INC. |
21 TADCASTER CIRCLE |
ATTN: PENELOPE J.A. AGODOA |
WALDORF, MD 20602 |
|
|
Search Results as of:
06/15/2024 05:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|