Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2009
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Application #:
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11483015
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Filing Dt:
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07/07/2006
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Publication #:
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Pub Dt:
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11/09/2006
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Inventors:
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Keng Lee Teo, Wey Ngee Chin
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Title:
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METHOD AND APPARATUS FOR SOLDERING MODULES TO SUBSTRATES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ST.-MARTIN-STRASSE 53 |
MUENCHEN, GERMANY 81669 |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON RD. |
SUITE 1000 |
DALLAS, TX 75252 |
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