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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11436329
Filing Dt:
05/18/2006
Publication #:
Pub Dt:
11/23/2006
Inventor:
Michael H. Bunyan
Title:
Thermal lamination module
Assignment: 1
Reel/Frame:
017964/0477Recorded: 07/19/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/30/2006
Assignee:
6035 PARKLAND BOULEVARD
CLEVELAND, OHIO 44124-4141
Correspondent:
WILLIAM G. GOSZ, ESQ.
450 BEDFORD STREET
LEXINGTON, MA 02420

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